Last updated: June 14, 2009

Mr. Whitcomb was a Senior Packaging Engineer for Motorola and On Semiconductor for over 25 years. Jon had Corporate ESD program responsibility for production and packaging engineering to include: meeting customer requirements for ESD compliant materials, documentation, and training. Site inspection and audits of 3rd party ESD laboratory and packaging suppliers, production certification runs and customer sites. Logistics packaging engineering responsibility included standards development, structural design, implementation of new design concepts, thermoformed ESD reels, tubes, trays and static shielding or moisture barrier bags, to meet international semiconductor requirements. Mr. Whitcomb initiated and implemented the design and documentation of RFID, RoHS and barcode/human readable label programs.

Mr. Whitcomb received his Master of Science in Packaging Engineering from Michigan State University in 1982 and a Masters of Science in Education from the University of Southern California in 1972. Jon belongs to the SPHE (Society of Packaging & Handling Engineers), ESD Association, National Electronics Distributor Association and Institute of Packaging Professionals. He was the Arizona Packaging Association President for several years.

He can be reached at jonw@esdrmv.com.

• Ameristar Package Award (by Institute of Packaging)
• Lifetime (by Institute of Packaging Professionals)
• Electrostatic Discharge Control Certified Engineer (by iNARTE)
• Contributions to the ESD Association Standards Commitee (by ESDA)
• Training Course for ESD Program Develpment (by ESDA)
• Product Safety Engineer (by iNARTE)
• Certified Member for 10 years (by iNARTE)
• Certicate of Appreciation for Volunteers (by ESDA)
• Member ACIL (by ACIL)
• Member in Good Standings (by Institute of Packaging Professionals)
• Certificate of Appreciation (by Association for Service Disabled Veterans)
• Certificate of Appreciation (by the ESD Association)
• Development of Bob Vermillion when he was in R&D with a major company (by United States Patent)
• Certificate of Achievement (by Lyncole XIT Grounding)
• Certificate of Completion (by NASA)