Events, Conferences & Forums


 


The University of Oxford presents a unique new course

Suspect Counterfeit Detection, Avoidance and Mitigation

Check back soon for next class scheduled for Summer 2012

http://cpd.conted.ox.ac.uk/electronics/2010_course_brochure.pdf

Are you or your supply chain properly handling Class 0 ESD sensitive devices with validated packaging during the parts inspection process? This 2-day course is in an interactive case study format and will review not only non-conformance related issues, but also validation methods often overlooked in a Suspect Counterfeit Countermeasure Program. The course provides in-depth technical review of validation issues:

 

—  Where do counterfeits come from?

—  How can counterfeits be identified?

—  How can counterfeiting be combated?

—  Are proper ESD measures being employed?

—  Does your inspection process compromise Class 0 ESD sensitive devices?

—  How are parts coded, tracked and safeguarded by employing RFID? 

 

Issues 

—  Supplier Non-Conformance

 

  Long Term Storage Issues

  Outdated Standards

  Lack of Class 0 Device Training

—  Incoming Inspection Practices

—  Inadequate Inspection of

  Sensitive Components

  Packaging Inspection?

  Validation beyond Parts!

  Physical Audits of Packaging Materials – Not Just Processes!

  Leadership from the Top Down!

Who is this course for?

Engineers & quality assurance, procurement engineering and supply chain management professionals who utilize or purchase components from systems integrators, manufacturers and distributors.

Industry Sectors for Application:

Aerospace & Defense, Semiconductor, Medical Device, Disk Drive, Industry Electronics, Automotive and Telecommunications

Course Presenters:

Bob Vermillion, RMV Technology Group, LLC at NASA-Ames Research Center (ARC), Moffett Field, CA.

Douglas Smith, Author of High Frequency Measurements and Noise in Electronic Circuits
Further Information


Website: - http://cpd.conted.ox.ac.uk/electronics/courses/counterfeit_detection.asp Tel: +44 (0)1865 286958 Email: technology@conted.ox.ac.uk


2011 NIPHLE Annual Conference

"Packaging for the War Fighter"

and DOD Packaging Awards Banquet

April 11 - 14, 2011

Hilton Palacio de Rio - River Walk

San Antonio, Texas

1:00 PM – 1:45 PM

“Packaging in the Acquisition Lifecycle”

 

 

Nancy Waltman,

Chief, Packaging Branch

RDECOM, ECBC

Engr. Dir, Product Engr. Div

1:45 PM– 2:30 PM

"Long Term Storage Solutions for Sensitive Packaging in Harsh Environmental Conditions"

Robert Vermillion, CPP/Fellow, iNARTE Certified ESD & Product Safety Engineer

RMV Technology Group, LLC NASA-Ames Research Center

2:45 PM - 3:30 PMSpecifications and GSA

Vitaly Shik,

Engineer- Specification Manager Federal Supply Service,GSA

3:30 PM – 4:30 PM

Panel Discussion

The Future of Military Packaging - Lakye Franklin, moderator, HQMC

7:00 PM - 9:30 PM

DOD Packaging Awards Banquet

El Mirador


 



 

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