The University of Oxford presents a unique new course
Suspect Counterfeit Detection, Avoidance and Mitigation
(30 June - 1 July 2011)
http://www.esdrmv.com/sites/default/files/technology_programme_brochure_2011_8.pdf
Are you or your supply chain properly handling Class 0 ESD sensitive devices with validated packaging during the parts inspection process? This 2-day course is in an interactive case study format and will review not only non-conformance related issues, but also validation methods often overlooked in a Suspect Counterfeit Countermeasure Program. The course provides in-depth technical review of validation issues:
— Where do counterfeits come from?
— How can counterfeits be identified?
— How can counterfeiting be combated?
— Are proper ESD measures being employed?
— Does your inspection process compromise Class 0 ESD sensitive devices?
— How are parts coded, tracked and safeguarded by employing RFID?
FYI from the G-19 committee chair.
ottom of Form“I have had the great pleasure of Bob Vermillion’s association for many years. Bob is a diligent subject matter expert in the area of electrostatic discharge mitigation and control, who brings a unique capability to the electronics industry. His unique proficiency is based in his vast practical materials, packaging and test experience that he applies to the applications and handling of all types of electronic hardware. A few years ago, Bob unassumingly brought to the attention of the industry the fact that packaging materials for ESD-sensitive items can be supplied as meeting industry standards, but are actually non-conforming or fraudulently misrepresented. The integrity of such materials is often overlooked by using organizations with consequences that could result in the failure of the devices, electronic hardware or equipment either immediately or later in application. Bob provides a service to mitigate these problems and has been instrumental in addressing such issues for several organizations. However, Bob’s talents go far beyond this one example. Bob can provide an evaluation of your handling practices with respect to ESD control, he can present and instruct on the subject and he can provide a total solution to your packaging problemsto enhance the size, weight, safety and reliability of the entire package. I would recommend Bob and his company to any organization involved with handling electronics and that wants to improve their assurance of providing reliable product to their customers.” March 27, 2012
1st Phil Zulueta, Former, Manager, Jet Propulsion Laboratory & Current G-19 Committee Chair
Issues
— Supplier Non-Conformance
— Long Term Storage Issues
— Outdated Standards
— Lack of Class 0 Device Training
— Incoming Inspection Practices
— Inadequate Inspection of
— Sensitive Components
— Packaging Inspection?
— Validation beyond Parts!
— Physical Audits of Packaging Materials – Not Just Processes!
— Leadership from the Top Down!
Who is this course for?
Engineers & quality assurance, procurement engineering and supply chain management professionals who utilize or purchase components from systems integrators, manufacturers and distributors.
Industry Sectors for Application:
Aerospace & Defense, Semiconductor, Medical Device, Disk Drive, Industry Electronics, Automotive and Telecommunications
Bob Vermillion is a member of the G-21 Counterfeit Materiel and Mechanical Parts Committee
Course Presenters:
Bob Vermillion, RMV Technology Group, LLC at NASA-Ames Research Center (ARC), Moffett Field, CA.
Douglas Smith, Author of High Frequency Measurements and Noise in Electronic CircuitsFurther Information
Suspect counterfeiting extends beyond the parts identification process. Over the past several years, U.S. based organizations have sacrificed the traditional “internal auditing process” with too much reliance upon offshore contract manufacturers, distributors and suppliers to do the right thing. To compound the problem, organizations are accepting supplier specifications as adequate proof in utilizing a product for use. The inspection of sensitive parts is very important, but without special safeguards, the additional handling to remove and repack the product for validation can cause both physical and ESD damage in the process. For parts, including those not sensitive to static electricity, measures must be utilized to detect, inspect and validate the packaging as well as incoming parts. “It is technologically possible to provide a hundred-fold increase in satellite-based broadband capacity.”
Preventative protection measures against suspect counterfeiting during transport for electronic circuit cards and ESD sensitive devices must be considered. Dog food, medical products, jewelry, consumer goods and other items have made the news.
Leadership in clearly defining an Anti-Counterfeiting Roadmap must be driven down by the customer! In my opinion, distributor practices must be subjected to physical audits of packaging materials, not just processes, to insure supplier conformance. Most of the distributors do not have the necessary skill sets to bring innovative methods to the table; consequently, the user must define requirements and physically audit the supply chain.
Who should attend?
Engineers & technicians, quality assurance, procurement and supply chain management professionals who buy components from systems integrators, manufacturers, distributors and brokers
Counterfeits = 10% of all Global Goods - Cost industry Up To $500 Billion Annually - Impact 750,000 US - Decrease customer satisfaction & acceptance - Reduce Yields - Increase Field Failures - Cause Injury - Increase Risk - Necessitate Product Inspection - Prompt Litigation- -Take Down High Value Systems - Increase risk
Sent: Friday, March 19, 2010 7:08 PM
Subject: RE: Follow up: NASA QLF Conference from Renee of RMV Technology Group
Renee,
Your presentation made a BIG splash and was noticed! Fresh and new! You offered a totally different angle to understanding counterfeit problems and issues.
Actually, at today’s JACP meeting, the presentation was brought up in an extremely positive manner in front of Brian H! Several people mentioned in opening comments (which Brian solicited input from the previous two day’s QLF’s meeting) that the presentation that you ‘all gave on packaging was refreshing since the Industry Leader Reps (JACP) and NASA members had not been fully exposed to packaging counterfeit complications.
You made a splash. You should continue to push it. Please do. It is an important component of the overall solution to solving the growing overwhelming counterfeit problem.
I am thinking, that from the comments from this morning, that you may get some emails or requests to present to industry reps (at the JACP level) at their respective companies.
Regards,
Al Cook
NASA, Ames Research Center (ARC)
