- Tobyhanna Army Depot
9 May 2018
The National, Institute of Packaging, Handling and Logistics Engineers (NIPHLE) consisting of the US Army, US NAVY, USMC, DLA, USAF, DCMA and Industry, honored Bob Vermillion, CPP, Fellow, RMV Technology Group, LLC with the James A. Russell Award, the highest recognition given each year by NIPHLE to recognize the Lifetime Achievement of an individual for advancements and innovations in the field of Packaging Engineering for greater protection of the Warfighter.
In 2015, RMV at NASA Ames, received the NIPHLE Corporate Award in support of the Warfighter.
Early on, Vermillion developed a static shielding MX Missile Shroud, and, in the primary development of a CDM safe electrostatic discharge shielding paperboard technology still in use today.
The development of a patent protected Containerboard for Electrostatic Discharge Sensitive Devices was followed by several other materials for superior shielding and charge mitigation properties.
As consultant for the Intel Pentium II Packaging Development Team in design of a package for high voltage discharge survival during transport, Bob provided the SME for ESD test and evaluation that led to a successful product launch.
To understand the risk of containerboard triboelectrification during air transport, winter and Santa Ana Wind conditions, Bob is the First to map differences between charge levels of paperboard (ROC, Europe & USA) at various relative humidity levels.
From SME evaluation training for the Inherently Conductive Polymer (ICP) Scientists to development of a NASA Mars Mission Approved containerboard, Vermillion placed 1st for the top USA Electronics packaging design (IOPP Ameristar 2002) that utilized a new ICP corrosion free, ESD shielding and tamper proof long-term storage package.
Vermillion’s efforts in R&D led to developments with high performance liners, numerous material reformulations and proprietary Trade Secret Test Methods for Triboelectrification prelaunch testing for harsh environments, including shake down testing for touch displays, electronic flight helmets, hand-held devices, wearables and Small Satellites.
In 2010, Vermillion was the First to Present and Publish on Suspect Counterfeit ESD & Packaging Materials in the Aerospace & Defense Supply Chain for the NASA Quality Leadership Forum which led to a series of articles on non-conforming products found in the DoD manufacturing arena.
In the area of materials, packaging and products utilized in the aerospace & defense and commercial sectors, Bob's advancements have led to the implementation of countermeasures by Fortune 500 corporations including some Federal agencies. RMV training includes NASA, UC Berkeley SSL, DoD primes, DOE, Cal Poly, Auburn, Clemson, CALCE and Loyola University since 2008.
In order to insure compliant protection of mountaineering equipment for USMC deployment to Afghanistan, Vermillion redesigned the package and recommended RFID tracking. Thereafter, Vermillion published a paper on ESD issues with RFID and packaging.
When a prime required UAV protocols for NAVAIR deployment compliance, Vermillion’s team received an Outstanding Past Performance in support of a DoD prime.
A featured speaker on Suspect Counterfeit materials and packaging for GIDEP since 2016, Vermillion also presented on successful CubeSat deployment test methods in cooperation with NASA AAQ and Auburn University School of Engineering in 2016 and 2017. Therein, Vermillion was invited to join the Expert Adviser panel. In the first quarter of 2018, Bob presented before the NASA QLF, Cape Canaveral with a return invitation for 2019.
As the NASA ESD Technical Authority and working member of the Interagency Working Group, Vermillion leads an ESD Aerospace Materials & Packaging Test Laboratory and Training Center at NASA Ames Research Center.
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