Bob Vermillion receives James A. Russell Lifetime Achievement Award

- Tobyhanna Army Depot

   9 May 2018


The National, Institute of Packaging, Handling and Logistics Engineers (NIPHLE) consisting of the US Army, US NAVY, USMC, DLA, USAF, DCMA and Industry, honored Bob Vermillion, CPP, Fellow, RMV Technology Group, LLC with the James A. Russell Award, the highest recognition given each year by NIPHLE to recognize the Lifetime Achievement of an individual for advancements and innovations in the field of Packaging Engineering for greater protection of the Warfighter. 



In 2015,   RMV at NASA Ames,  received the NIPHLE Corporate Award in support of the Warfighter.  


Early on, Vermillion developed a static shielding MX Missile Shroud,  and, in the primary development of a CDM safe electrostatic discharge shielding paperboard technology still in use today.


The development of a patent protected Containerboard for Electrostatic Discharge Sensitive Devices was followed by several other materials for superior shielding and charge mitigation properties.


As consultant for the Intel Pentium II Packaging Development Team in  design of a package for high voltage discharge survival during  transport, Bob  provided the SME  for ESD test and evaluation that led to a successful product launch.


To understand the risk of  containerboard triboelectrification during air transport, winter and Santa Ana Wind conditions, Bob is the First to map differences between charge levels of  paperboard (ROC, Europe & USA)  at various relative humidity levels.  


From SME evaluation training for the Inherently Conductive Polymer (ICP) Scientists to development of a  NASA Mars Mission Approved containerboard, Vermillion placed 1st for the top USA Electronics packaging design (IOPP Ameristar 2002) that  utilized a new ICP corrosion free, ESD shielding and tamper proof long-term storage package. 


Vermillion’s efforts in R&D  led to developments with high performance liners, numerous material reformulations and proprietary Trade Secret Test Methods for Triboelectrification prelaunch testing for  harsh environments, including shake down testing for touch displays, electronic flight helmets,  hand-held devices, wearables and Small Satellites.


In 2010,  Vermillion was the First to Present and Publish on Suspect Counterfeit ESD & Packaging Materials in the Aerospace & Defense Supply Chain for the NASA Quality Leadership Forum which led to a series of articles on non-conforming products found in the DoD manufacturing arena.  


In the area of materials, packaging and products utilized in the aerospace & defense and commercial sectors, Bob's advancements have led to the  implementation of countermeasures by Fortune 500 corporations including some Federal agencies. RMV  training  includes  NASA, UC Berkeley SSL, DoD primes,  DOE, Cal Poly,  Auburn, Clemson, CALCE  and Loyola University since 2008.   


In order to insure compliant  protection of mountaineering equipment for USMC deployment to Afghanistan,  Vermillion redesigned the package and recommended RFID tracking. Thereafter, Vermillion published a paper on ESD issues with  RFID and packaging.


When a prime required UAV protocols for NAVAIR deployment compliance, Vermillion’s team received an Outstanding Past Performance in support of a DoD prime.


A featured speaker on Suspect Counterfeit materials and packaging for GIDEP since 2016, Vermillion also  presented  on successful CubeSat deployment test methods in cooperation with  NASA AAQ and Auburn University School of Engineering in 2016 and 2017.  Therein, Vermillion was invited to join the  Expert Adviser panel.  In the first quarter of 2018, Bob presented before the NASA QLF, Cape Canaveral with a return invitation for 2019. 


As the NASA ESD Technical Authority and working member of the Interagency Working Group, Vermillion leads an ESD Aerospace  Materials & Packaging Test Laboratory and Training Center at NASA Ames Research Center. 


For more information, please contact us onsite at Moffett Field (650-964-4792) or email  for more information on engineering services, training or upcoming speaking events.  





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RMV Technology Group LLC
NASA Research Park
350 N. Akron Road, B-19
Room 1073, P O Box 7
Moffett Field, CA 94035-0007
T  650-964-4792
F  650-964-1268 
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