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Tool Tip Testing

Ceramic Bonding Tool Tip Testing

RMV Subject Matter Expertise


The Industry Leading Engineers of RMV Technology Group LLC conduct  controlled Ceramic Bonding Tool Tip Resistance Testing for the Consumer Electronics, Disk Drive, Semiconductor, Aerospace & Defense and Space Technology sectors.  

Bob Vermillon,  CEO, RMV,  an active member of the ESDA Hand Tools Committee, is also a Round Robin Test Lab that performs materials testing  alongside IBM, Seagate, 3M and Wright Patterson Air Force Base. 

RMV only employs US citizens and all work is performed in our onsite ESD testing laboratory on a Federal facility.   With 24-hour surveillance for all  buildings here at NASA, you can be assured that your product will be handled with the utmost care and security.

ANSI/ESD STM 13.1-2000 

ANSI/ESD STM 13.1-2000 [WIP for 2008] Electrical Soldering/Desoldering Hand Tools

This standard test method provides electric soldering/desoldering hand tool test methods for measuring the electrical leakage and tip to ground reference point resistance and provide parameters for EOS safe soldering operation.

Solder Iron Tip Testing Methods

IPC-J-STD-001E Test Method

MIL STD-2000

A number of ESD Standard Test Methods are employed to measure charge buildup,  resistance of the tool tip assembly and other application specific test procedures for individual customer requirements.  Tool tip resistance will vary in resistance dependant upon the manufacturer requirements.  For example, in the disk drive industry, magnetic heads can be damaged by less than one volt. 


RMV utilizes the most advanced instrumentation to measure the sensitivity of the tool tip and provides the customer with a detailed report not only mapping the measurements, but also in an educational format for senior level management review.


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