The Industry Leading Engineers of RMV Technology Group LLC conduct controlled Ceramic Bonding Tool Tip Resistance Testing for the Consumer Electronics, Disk Drive, Semiconductor, Aerospace & Defense and Space Technology sectors.
Bob Vermillon, CEO, RMV, an active member of the ESDA Hand Tools Committee, is also a Round Robin Test Lab that performs materials testing alongside IBM, Seagate, 3M and Wright Patterson Air Force Base.
RMV only employs US citizens and all work is performed in our onsite ESD testing laboratory on a Federal facility. With 24-hour surveillance for all buildings here at NASA, you can be assured that your product will be handled with the utmost care and security.
ANSI/ESD STM 13.1-2000
ANSI/ESD STM 13.1-2000 [WIP for 2008] Electrical Soldering/Desoldering Hand Tools
This standard test method provides electric soldering/desoldering hand tool test methods for measuring the electrical leakage and tip to ground reference point resistance and provide parameters for EOS safe soldering operation.